机译:基于TSV的正交线圈,生物医学植入物中的电感电力传输高度耐受公差
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Ningbo Univ Fac Elect Engn & Comp Sci Ningbo 315211 Peoples R China;
Coils; Windings; Through-silicon vias; Inductance; Couplings; Silicon; Retina; Through silicon via; 3-D integration; inductive power transfer; coil misalignment; power transfer efficiency;
机译:植入医疗装置的电感经皮动力转移系统中线圈未对准的方法
机译:生物医学植入物未对准条件下圆形和球形线圈的无线动力传递分析
机译:旋转线圈未对准对感应功率传输系统的传输参数的影响
机译:用于生物医学植入物的无线电力传输链路的线圈未对准补偿概念
机译:生物医学植入物中无线电力传输链路的线圈未对准补偿技术
机译:基于模型的系统工程应用于植入生物医学微生物的无线电力传输技术的权衡分析
机译:旋转线圈未对准对电感电力传输系统传输参数的影响