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Decoupling with Embedded Capacitors

机译:与嵌入式电容器去耦

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摘要

In a previous article ("Decoupling with Surface Mount Capacitors," CircuiTree, June 2003), we described what decoupling is and how it's done on PWBs today. In this article, we'll provide a brief summary of the technical reasons that make embedded caps more attractive for this than surface mount, followed by an overview of what's becoming available commercially for you to use. The overall conclusion is going to be that the decoupling caps scattered over the board should be embedded based on cost considerations, while the close-in caps, those grouped around individual chips, should be replaced on performance considerations―lower inductance.
机译:在上一篇文章(“表面贴装电容器去耦”,CircuiTree,2003年6月)中,我们描述了什么是去耦以及今天如何在PWB上完成去耦。在本文中,我们将简要概述使嵌入式盖对此比表面安装更具吸引力的技术原因,然后概述在市场上可以买到的产品。总的结论是,散布在板上的去耦电容应基于成本考虑而嵌入,而封闭电容(围绕单个芯片分组的电容)应出于性能考虑而更换,即降低电感。

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