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Process Options for Copper Circuit Manufacture

机译:铜电路制造的工艺选择

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Additive, semi-additive, semi-subtractive, sub-tractive.... Whether they are rigid or flexible, this is the basic shopping list of methods for creating copper circuits for printed circuits. While previous columns have touched on the different types of copper foil used to produce flex circuits (e.g. wrought foil versus plated foil) and discussed their relative merits, the methods of circuit creation using the different offerings is an interesting subject that is worthy of review. Of the four choices given above, the first and last options are fairly self-explanatory. However, one might rightfully ask if there is any difference between semi-additive and semi-subtractive, or are they one and the same? A review of the different methods should help to answer the question.
机译:加法,半加法,半减法,减法....无论是刚性的还是柔性的,这都是制造印刷电路铜电路的基本方法清单。虽然先前的专栏文章探讨了用于生产柔性电路的不同类型的铜箔(例如锻造箔与电镀箔)并讨论了它们的相对优点,但使用不同产品的电路创建方法是一个有趣的话题,值得回顾。在上面给出的四个选项中,第一个和最后一个选项很容易解释。但是,一个人可能会正确地问半加法和半减法之间是否有区别,或者它们是一样的?对不同方法的回顾应有助于回答这个问题。

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