Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs)

摘要

Higher packaging densities for the next generation of electronic devices require utilization of the inner space of a PWB for component placement. This will shift some added value assembly processes from the assembly houses backwards to the PWB fabricator. (Regardless of whether it is liked or disliked by the PWB fabricators). ASPOCOMP, as a leader in advanced PWB technology, is developing these technologies to meet the needs of key Original Equipment Manufacturers (OEMs). The paper describes the present experiences with this new technology and details where there are technology limits. Material suppliers will be challenged to provide better solutions than exist today. Sequential versus parallel PWB manufacturing processes will be reviewed and the requirements to meet the manufacturing and cost targets for the next generation of PWBs will be discussed.