Development of a comprehensive in-line quality control system for printed circuit board assemblies

摘要

Purpose - To present an overview of the research and development carried out by an EC Framework 6 part funded consortium, known as MICROSCAN, for the implementation of an in-line PCB inspection prototype system that is capable of offering comprehensive defect detection. Design/methodology/approach - Four non-destructive testing inspection modules based on digital radiography (X-ray) inspection, thermal inspection, automated-optical inspection and acoustic inspection have been integrated to form a combined inspection system. Findings - A proof in principle in-line PCB inspection system, utilising four different inspection techniques, has been developed and demonstrated. The system is based on a generic mechanical, electrical and software communications platform culminating in a flexible system that enables the inspection modules to be used separately, together or interchanged to give the best results in terms of inspection coverage and inspection throughput. Research limitations/implications - In its current embodiment, the prototype is suited to inspection of high-return PCBs, particularly those used in medical and aerospace products, rather than high-throughput PCB production work. The X-ray inspection module is the slowest inspection technique and combining four different inspection techniques reduces the inspection throughput of the whole system to that of the X-ray inspection module. Further, trials and investigations need to be carried out to improve inspection throughput. Originality/value - The novelty of the system is that it is the first time that four inspection techniques have been combined to give the capability of 100 per cent defect coverage.