首页> 外文期刊>Circuit World >Assessment of risk resulting from unattached tin whisker bridging
【24h】

Assessment of risk resulting from unattached tin whisker bridging

机译:未连接锡晶须桥接造成的风险评估

获取原文
获取原文并翻译 | 示例
       

摘要

Purpose - This paper aims to present a methodology for estimating the risk of component level electrical bridging failures from unattached conductive (tin) whiskers. Design/methodology/approach - Based on experimental data an algorithm was developed and assessed by further experiments. The risk estimate is based on whisker parameters, generated from experiments over a period of time. A bridging failure risk is defined as the probability of a conductive whisker landing between two isolated electrical conductors. A probabilistic estimate for electrical bridging failure risk is achieved by randomly sampling distributions of conductive whisker length, deposition angle, and density for a defined electrical structure. A fine pitch quad flat package attached to a printed wiring board is used as test vehicle to verify the risk estimate. Findings - The estimated risk is found to be higher than planned in the experimental test. The lower experimentally determined risk was found to be the result of high contact resistance between the conductive whisker and the electrical conductors that form the unintended circuit Contact resistance between the whisker and electrical conductors was found to mitigate the whisker shorting risk. Originality/value - This is the first attempt to quantify the risk failure due to unattached conductive whiskers in electronic products. A methodology for estimating electrical bridging risk due to unattached conductive whiskers is provided. Contact resistance of conductive whiskers is found to be a critical issue that may be mitigate failure risks.
机译:目的-本文旨在提出一种方法,用于评估未连接的导电(锡)晶须引起的组件级电桥故障的风险。设计/方法/方法-根据实验数据,开发了一种算法,并通过进一步的实验进行了评估。风险评估基于晶须参数,这些参数是在一段时间内通过实验生成的。桥接故障风险定义为导电晶须在两个隔离的电导体之间着落的可能性。通过随机采样定义的电气结构的导电晶须长度,沉积角和密度的分布,可以实现对电桥失效风险的概率估计。使用附接到印刷线路板上的细间距四方扁平封装作为测试工具,以验证风险估算。调查结果-估计的风险高于实验测试中的计划。实验确定的较低风险是由于导电晶须与形成意外电路的电导体之间的高接触电阻而导致的,结果发现,晶须与电导体之间的接触电阻降低了晶须短路的风险。原创性/价值-这是对由于电子产品中未连接导电晶须而引起的风险失效进行量化的首次尝试。提供了一种用于估计由于未连接的导电晶须而引起的电桥接风险的方法。发现导电晶须的接触电阻是一个关键问题,可以减轻故障风险。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号