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Integrated optical and electronic interconnect printed circuit board manufacturing

机译:集成式光电子互连印刷电路板制造

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Purpose - To introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations, fabrication techniques, layout design rules and characterisation techniques for hybrid electronic and optical printed circuit boards (PCBs) using multimode polymer optical waveguide interconnects. Design/methodology/approach - The authors are investigating a number of different fabrication techniques which they compare with each other and with modelled calculations of waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing. Findings - A number of design rules for polymer multimode waveguides have been found and published. Techniques for ink jetting polymer to print waveguides and laser ablation techniques have been developed. New formulations of polymer which cure faster for direct writing have also been developed. Research limitations/implications - Further work is needed to thicken the ink jet printed polymer and to investigate side wall roughness of the ablated waveguides and development of new polymer formulations for dry film. Further research is also needed on construction of prototype system demonstrators. Practical implications - The fabrication techniques being developed are designed to be transferred to industrial PCB manufacturers to enable them to make higher value optical PCBs. The design rules being discovered are being entered into commercial PCB layout software to aid designers of optical PCBs. Originality/value - The paper is of interest to PCB manufacturers who wish to upgrade their processes to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list.
机译:目的-介绍创新的电子制造研究中心旗舰项目:集成光学和电子互连PCB制造,其目标,由三所大学和十家公司组成的财团,并描述正在进行的大学研究。本文简要回顾了使用多模聚合物光波导互连技术开发用于混合电子和光学印刷电路板(PCB)的新型聚合物配方,制造技术,布局设计规则和表征技术的动机。设计/方法/方法-作者正在研究许多不同的制造技术,它们相互比较,并与波导组件的建模计算进行比较。制造技术包括光刻,激光烧蚀,直接激光写入,压纹,挤出和喷墨印刷。发现-已经找到并发布了许多用于聚合物多模波导的设计规则。已经开发了用于喷墨聚合物以印刷波导的技术和激光烧蚀技术。还开发了可更快固化以进行直接书写的聚合物新配方。研究的局限性/意义-需要做进一步的工作来使喷墨打印的聚合物增稠,并研究烧蚀波导的侧壁粗糙度以及开发用于干膜的新型聚合物配方。原型系统演示器的构造也需要进一步研究。实际意义-正在开发的制造技术旨在转移给工业PCB制造商,以使他们能够制造更高价值的光学PCB。正在发现的设计规则已输入到商业PCB布局软件中,以帮助光学PCB设计人员。原创性/价值-这篇论文对希望升级其工艺以制造光学PCB的PCB制造商感兴趣。该大学的研究是原创的,有些已经被发表了,如参考文献中的出版物所示。

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