EnFACE: a maskless process for circuit fabrication

摘要

Purpose - The purpose of the paper is to present an update and the latest results from work on a project which could be useful for maskless printedrncircuit board (PCB) manufacturing.rnDesign/methodology/approach - Copper is plated and etched using a novel electrochemical technique, electrochemical patterning by flow andrnchemistry, using a masked tool and fully exposed substrate. The micro patterns on the tool are replicated on the substrate via optimum design of thernapparatus, choice of electrolyte chemistry and fluid flow.rnFindings - Linear and square shapes ranging from 5 to 200 μm are transferred using the technique by electrochemical plating and etching. Up torn25 substrates could be processed using a single tool, which indicates that photolithography requirements can be greatly minimised.rnResearch limitations/implications - The copper lines are transferred to relatively small substrates. The process needs to be scaled up tornaccommodate larger substrates in order to fully exploit its potential for PCBs.rnOriginality/value - The paper presents a fundamentally different approach to transfer micron scale pattern using a maskless technology. The platformrntechnology involves using a mask to pattern each substrate; this work shows that micron scale patterns can be transferred without masking byrnoptimising electrochemical reactor technology.