Halogen-free materials with improved thermal and electrical properties

摘要

Purpose - The purpose of this paper is to present a latest update on halogen-free base materials that are lead-free compatible and have enhancedrnelectrical properties.rnDesign/methodology/approach - Numerous halogen-free flame retardants are screened in laboratory conditions for a wide arrange of properties.rnOnce suitable candidates are found, they are compounded and processed into copper-clad laminates and a wide variety of properties are tested.rnFindings - Several formulations are found that are lead-free compatible and that has enhanced electrical properties. Surprisingly, some thermalrnproperties are found to be superior to traditionally halogenated laminates.rnResearch limitations/implications - The research here only presents the halogen-free properties of a bare, unpopulated printed wiring board withrnno build up of inner layers and devoid of solder mask. Further work needs to be done on full circuit assemblies to properly evaluate the impact ofrnremoving halogens from interconnecting packages.rnOriginality/value - The paper details the material property differences between various halogen-free materials as compared to halogenatedrnmaterials. A method to model composite properties is also discussed.