机译:内部装有分立去耦电容器的低功耗噪声多层PCB
Package Test Technology Team, Memory Division, Samsung Electronics, Asan, South Korea;
School of Information and Communication, Sungkyunkwan University, Suwon, South Korea;
School of Information and Communication, Sungkyunkwan University, Suwon, South Korea;
School of Information and Communication, Sungkyunkwan University, Suwon, South Korea;
Package Test Technology Team, Memory Division, Samsung Electronics, Asan, South Korea;
Package Test Technology Team, Memory Division, Samsung Electronics, Asan, South Korea;
printed circuits; capacitors; electric power supplies; switching systems; electric power transmission;
机译:解耦电容对多层PCB的局部去耦效果:闭合表达式快速分析
机译:解耦电容对多层PCB的局部去耦效果:闭合表达式快速分析
机译:使用多层封装和PCB中的嵌入式薄膜电容器来抑制GHz范围的电源/地感应阻抗并同时产生开关噪声
机译:低功率噪声多层PCB内部具有离散分离电容
机译:3-D集成电路中片上去耦电容器的有效距离计算。
机译:在PCB变压器或电容器事故之后接触PCB氯化二苯并二恶英和二苯并呋喃后对暴露者进行医疗监视。
机译:通过多层封装和pCB中的切口分析和抑制电源/接地平面腔之间的ssN噪声耦合