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The 'Non-Globalization' of Innovation in the Semiconductor Industry

机译:半导体行业创新的“非全球化”

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The global semiconductor industry is undergoing several forms of structural change simultaneously. The structure of market demand is shifting from one dominated by personal computers to a more diverse array of heterogeneous niches, largely resulting from global diffusion of the Internet and wireless communications applications. The structure of manufacturing activities is shifting from one dominated by "integrated device manufacturers" (IDMs) that both design and manufacture semiconductor components to one characterized by vertical specialization, where many firms specialize in either design and marketing ("fabless" firms) or manufacturing ("foundries"). Finally, market demand and technical expertise are growing in geographic regions (e.g., Malaysia, Singapore, and the People's Republic of China) that formerly were much less prominent actors in the global industry. In the face of such far-reaching structural change in the industry, it is surprising that most indicators of "globalization" of innovation-related activities in the U.S. semiconductor industry—ranging from publicly available data on the share of industry-funded R&D that is performed offshore to the location of inventive activity associated with patenting by U.S. firms—indicate only modest offshore movement in key innovation-related activities. To a surprising extent, this evidence suggests that much of the innovation process in this global industry remains "non-globalized."
机译:全球半导体产业正在同时经历几种形式的结构变化。市场需求的结构正在从个人计算机为主的结构转变为种类繁多的异构市场,这主要是由于Internet和无线通信应用程序的全球普及所致。制造活动的结构正在从设计和制造半导体组件的“集成器件制造商”(IDM)主导的结构转变为以纵向专业化为特征的结构,在这种情况下,许多公司专门从事设计和营销(“无晶圆厂”公司)或制造专业(“铸造厂”)。最后,市场需求和技术专长在地理区域(例如,马来西亚,新加坡和中华人民共和国)不断增长,而这些地理区域以前在全球行业中的地位不那么突出。面对行业如此深远的结构性变化,令人惊讶的是,美国半导体行业中与创新相关的活动的“全球化”大多数指标-来自可公开获得的有关行业资助的研发份额的数据,即在离岸美国进行的与美国公司专利相关的发明活动的地点进行的活动-仅表明在关键的与创新相关的活动中有适度的离岸活动。令人惊讶的是,这一证据表明,这个全球行业的许多创新过程仍然是“非全球化的”。

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