In China, Senju Metal Taps Micro Solder Ball to Promote Compact Chip Packaging

摘要

Senju Metal Industry Co., Ltd. has been strengthening its efforts in the micro soldering field in response to the trend toward finer integration of semiconductor packages. In China, the company aggressively pursues market introduction of micro balls, with Senju Metal (Shanghai) Co., Ltd. taking the lead. Tomohide Hasegawa, General Manager of Senju Metal (Shanghai), says, "Semiconductor production in China lags behind that in Japan, Korea, and Taiwan, and it is yet to develop, but we have hope that it will grow from now on."