Solder Paste for Power Device Replaces Preform

摘要

Koki Company Limited has released a new solder paste that is meant for bear chip joining in power devices. Conventionally, solder preforms are used for soldering power devices because using solder paste is considered to cause occurrence of voids, and require cleaning of flux residue to secure the required level of reliability. Soldering with solder preforms, however, necessitates the use of jigs and consumes time for putting on and taking off the fixtures, thus resulting in rather low work efficiency. Koki has succeeded in developing a solder paste for power device application, solving all the problems mentioned.