ASM Assembly Systems Aims to Lead in Next-Generation Chip Packaging

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ASM Assembly Systems Aims to Lead in Next-Generation Chip Packaging

机译：ASM Assembly Systems旨在领导下一代芯片封装

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ASM Assembly Systems GmbH & Co. KG and ASM Pacific Technology (ASMPT) jointly showcased advanced packaging and mounting technology solutions at SEMICON Taiwan 2018, which was held from Sept. 5 to 7 in Taipei, Taiwan. ASMPT secures high share of the semiconductor packaging and bonding market.

机译：ASM Assembly Systems GmbH＆Co. KG和ASM Pacific Technology（ASMPT）在9月5日至7日在台湾台北举行的SEMICON Taiwan 2018上共同展示了先进的包装和安装技术解决方案。 ASMPT确保了半导体封装和键合市场的高份额。

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《Asia electronics industry》 |2018年第11期|60-60|共1页
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1. A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process [J] . Changsoo Jang, Seongyoung Han, Hangyu Kim, Microelectronics & Reliability . 2006,第2a4期

机译：芯片/薄膜组装过程中超细间距柔性覆晶和带载封装的引线断裂问题的数值失效分析
2. Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications [J] . Jang C., Han S., Ryu J., IEEE Transactions on Advanced Packaging . 2007,第期

机译：下一代用于LCD应用的小间距柔性柔性封装的组装过程中的问题
3. Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications [J] . Jang C., Han S., Ryu J., IEEE Transactions on Advanced Packaging . 2007,第1期

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4. Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package [C] . Nokibul Islam, Vinayak Pandey, KyungOe Kim IEEE Electronic Components and Technology Conference . 2017

机译：具有引线键合（BOL）装配的小间距铜柱挑战了低成本和高性能倒装芯片封装
5. Lead-free assembly and reliability of chip scale packages and 01005 components. [D] . Liu, Yueli. 2006

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6. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

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7. Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing [O] . Robert Fischbach, Tilman Horst, Jens Lienig 2019

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8. Use of special purpose assembly test chips for evaluating reliability in packaged devices [R] . Sweet, J N 1992

机译：使用专用组装测试芯片评估封装器件的可靠性

ASM Assembly Systems Aims to Lead in Next-Generation Chip Packaging

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