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Condensation heat transfer coefficient versus wettability

机译:冷凝传热系数与润湿性

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In this paper we show how condensation on substrates can induce wetting behavior that is quite different from that of deposited or impinging drops. We describe surfaces with the same wettability in ambient conditions presenting different wetting behavior and growth of droplets in condensation. The experimental results show a rapid spread of droplets and formation of the film on the copper surface, while droplets on SU-8 surface remains on the regular shape while they grow within the time, without coalescence, as observed for Cu. Although the heat conductivity of SU-8 is much lower, due to a difference in wetting behavior, the heat transfer coefficient (h) is higher for dropwise condensation on Cu with a thin layer of SU-8 than filmwise on the bare copper. (C) 2015 Elsevier B.V. All rights reserved.
机译:在本文中,我们显示了基材上的冷凝物如何引起与沉积或撞击液滴完全不同的润湿行为。我们描述了在环境条件下具有相同润湿性的表面,这些表面呈现出不同的润湿行为和凝结中液滴的生长。实验结果表明,液滴快速扩散并在铜表面形成了膜,而SU-8表面上的液滴在一定时间内仍保持规则形状,并且在一定时间内生长,没有聚结,如对Cu观察到的那样。尽管SU-8的热导率要低得多,但由于润湿行为的差异,对于在SU-8薄层上的Cu进行逐滴冷凝时,传热系数(h)高于在裸铜上的逐滴冷凝。 (C)2015 Elsevier B.V.保留所有权利。

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