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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Development of textured Ni substrates for coated conductor prepared by powder metallurgy and plasma arc melting method
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Development of textured Ni substrates for coated conductor prepared by powder metallurgy and plasma arc melting method

机译:粉末冶金和等离子弧熔化法制备的带涂层镍导体结构化基材的研制

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摘要

We fabricated the textured Ni substrate and evaluated the effects of processing variables on microstructural evolution and texture transformation. Ni-rods as an initial specimen were prepared by two different methods, i.e., powder metallurgy (P/M) and plasma arc melting (PAM). To evaluate the effect of two preparation methods, the initial specimens were prepared to be of same size and experienced by same rolling conditions. The texture of the substrate was characterized by pole-figure and surface condition was evaluated by atomic force microscopy. It was observed that the texture of substrate made by P/M did not significantly varied with annealing temperature of 800 ~ 1200°C and the full-width at half-maximums (FWHM) of both in-plane and out-of-plane were 9° ~ 10°. On the other hand, the texture of substrate made by PAM was more dependent on the annealing temperature and the FWHM of in-plane texture was 9° ~ 13° at the temperature range. In addition, twin texture, (221), was formed as the temperature increased further. OM micrographs showed that the grain size of substrate made byP/M was smaller than that made by PAM and this difference was correlated to the microstructure of initial specimens.
机译:我们制造了织构化的镍衬底,并评估了加工变量对微结构演变和织构转变的影响。通过两种不同的方法,即粉末冶金(P / M)和等离子弧熔化(PAM),制备了镍棒作为初始样品。为了评估两种制备方法的效果,将初始试样制备为具有相同的尺寸,并在相同的轧制条件下经历。用极图表征基材的织构,并通过原子力显微镜评价表面状况。观察到,P / M制得的基材的纹理在退火温度为800〜1200°C时并没有明显变化,并且面内和面外的半峰全宽(FWHM)均为9°〜10°。另一方面,PAM制得的基材的织构更多地取决于退火温度,并且在该温度范围内,面内织构的FWHM为9°〜13°。另外,随着温度的进一步升高,形成了孪晶织构(221)。 OM显微照片显示,P / M制得的基底的晶粒尺寸小于PAM制得的基底的晶粒尺寸,并且该差异与初始样品的微观结构有关。

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