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首页> 外文期刊>Applied Physics. A, Materials Science & Processing >Ultra-short laser ablation of metals and semiconductors: evidence of ultra-fast Coulomb explosion
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Ultra-short laser ablation of metals and semiconductors: evidence of ultra-fast Coulomb explosion

机译:金属和半导体的超短激光烧蚀:超快速库仑爆炸的证据

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摘要

We have studied ultra-fast laser ablation of Si and a metal via the neutral and ion yield, the energy distribution of emitted neutrals and the charge distribution as a function of the laser pulse width. Two processes, one leading to the ejection of fast (3-7 eV), the other to slow thermal particles, can be identified. The origin of the first process can be correlated with laser pulse widths (or pump-probe delays) and processed on a time scale below 100 fs. Results for Si confirm recent findings for Coulomb explosion (CE) and we show for the first time that CE exists as a mechanism of material removal from metals for ultra-short laser pulses.
机译:我们已经研究了通过中性和离子产率,发射的中性物的能量分布以及电荷分布与激光脉冲宽度的函数关系对硅和金属进行超快速激光烧蚀。可以确定两个过程,一个导致快速(3-7 eV)喷射,另一个导致缓慢的热粒子喷射。第一个过程的起点可以与激光脉冲宽度(或泵浦探测延迟)相关联,并可以在低于100 fs的时间范围内进行处理。 Si的结果证实了库仑爆炸(CE)的最新发现,并且我们首次证明CE作为超短激光脉冲从金属中去除材料的一种机制。

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