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Selective laser processing of ink-jet printed nano-scaled tin-clad copper particles

机译:喷墨印刷的纳米锡包铜颗粒的选择性激光加工

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The deposition of tin-clad nano-size copper particles was carried out by means of ink-jet printing. Curing the particles on Polyimide (PI) turned them into soldered structures using an Nd-YAG laser. Area coverage of 55% was achieved for a single-layer print. Subsequent laser sintering increased this value to 95%. A Butanol-based copper ink and an aqueous tin (Sn)-clad Copper (Cu) ink were produced and were ink-jetted in this work. These nano-metallic inks showed excellent suspension stability with particle weight concentrations as high as 5%. The ink components were examined by measuring the particle size distribution in a dispersed condition, and the melting temperature. A piezo ink-jet print head was used to deposit the inks onto a moveable substrate. The thermal effect of the laser irradiation allowed approaching and connecting adjacent particles by melting the particle’s tin coating. The results were examined with regard to structure and soldering properties using EDX, SEM and optical microscopy.
机译:镀锡的纳米级铜颗粒的沉积通过喷墨印刷进行。使用Nd-YAG激光将颗粒固化在聚酰亚胺(PI)上,将其转变为焊接结构。单层印刷的区域覆盖率为55%。随后的激光烧结将该值提高到95%。生产丁醇基铜油墨和水性锡(Sn)包覆的铜(Cu)油墨,并在这项工作中进行喷墨。这些纳米金属油墨显示出优异的悬浮稳定性,颗粒浓度高达5%。通过测量分散条件下的粒度分布和熔融温度来检查油墨成分。使用压电喷墨打印头将墨水沉积到可移动的基材上。激光辐照的热效应通过熔化颗粒的锡涂层允许接近并连接相邻的颗粒。使用EDX,SEM和光学显微镜检查了有关结构和焊接性能的结果。

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