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Electrical characterization and fabrication of organic/inorganic semiconductor heterojunctions

机译:有机/无机半导体异质结的电气表征和制备

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Thin films of polyaniline (PANI) titanium dioxide (TiO2) nanocomposites prepared with and without surfactant (tetradecyltrimethylammonium bromide, TTAB) were formed by spin coating onto chemically cleaned p-type silicon substrates. The current–voltage characteristics of the Au/PANI TiO 2/p-Si/Al and Au/PANI TiO 2 TTAB/p-Si/Al heterojunctions had rectifying behavior with the potential barrier formed between the polymeric thin films and p-Si semiconductor, and they were analyzed on the basis of the standard thermionic emission (TE) theory. Cheung functions combined with conventional forward I–V characteristics were used to obtain diode parameters such as barrier height, ideality factor and series resistance (R s ). The values of barrier height, ideality factor and R s were found as 0.496±0.003 eV, 2.313±0.067 and 23.633±7.554 Ω for the Au/PANI TiO 2/p-Si/Al device; 0.494±0.003 eV, 2.167±0.018 and 12.929±2.217 Ω for the Au/PANI TiO 2 TTAB/p-Si/Al device. In addition, the energy distributions of the interface state density of the devices were determined from the forward I–V characteristics by taking into account the bias dependence of the ideality factor and barrier height. It was seen that the PANI TiO 2 TTAB/p-Si device had slightly higher interface state density values than those of the PANI TiO 2/p-Si device.
机译:通过旋涂到化学清洗过的p型硅基板上,形成有和没有表面活性剂(十四烷基三甲基溴化铵,TTAB)制备的聚苯胺(PANI)二氧化钛(TiO 2 )纳米复合材料薄膜。 Au / PANI TiO 2 / p-Si / Al和Au / PANI TiO 2 TTAB / p-Si / Al异质结的电流-电压特性具有整流特性。在聚合物薄膜和p-Si半导体之间形成势垒,并根据标准热电子发射(TE)理论对其进行了分析。将祥函数与传统的正向I–V特性相结合,可以得到二极管的参数,例如势垒高度,理想因子和串联电阻(R s )。 Au / PANI TiO 2 / p的势垒高度,理想因子和R s 的值分别为0.496±0.003 eV,2.313±0.067和23.633±7.554Ω -Si / Al器件; Au / PANI TiO 2 TTAB / p-Si / Al器件的电阻为0.494±0.003 eV,2.167±0.018和12.929±2.217Ω。此外,器件的界面态密度的能量分布是通过考虑理想因子和势垒高度的偏置依赖性从正向IV特性确定的。可以看出,PANI TiO 2 TTAB / p-Si器件的界面态密度值略高于PANI TiO 2 / p-Si器件。

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