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Resistive switching mechanism in silicon highly rich SiOx (x < 0.75) films based on silicon dangling bonds percolation model

机译:基于硅悬键渗流模型的高富硅SiO x (x< 0.75)薄膜中的电阻切换机制

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摘要

The unipolar resistive switches are investigated in silicon highly rich SiOx (x < 0.75) films. The as-deposited SiO0.73 films contain high concentration (1.0 × 1019 cm-3) of silicon dangling bonds (Si-DBs) and are rich in SiO2≡Si–Si and O3≡Si–Si configurations. Unlike the currently reported normal silicon-rich SiOx (x > 1.8) based devices, our Pt/SiO0.73/Pt devices operate at lower voltage regime (<2.0 V) and exhibit much lower resistance (∼30 Ω). The reset voltage (∼0.7 V) is lower than set voltage (∼1.7 V) and the performance is reduced in the vacuum environment. We propose a Si-DBs percolation model to explain the above characteristics. The experimental evidences for supporting our model are presented and discussed.
机译:在高硅含量的SiO x (x <0.75)薄膜中研究了单极电阻开关。沉积后的SiO 0.73 膜包含高浓度(1.0×10 19 cm -3 )的硅悬空键(Si-DBs)和富含SiO 2 ≡Si-Si和O 3 ≡Si-Si构型。与当前报道的普通的富含硅的SiO x (x> 1.8)器件不同,我们的Pt / SiO 0.73 / Pt器件在较低的电压范围(<2.0 V)下工作并显示出低得多的电阻(约30Ω)。复位电压(〜0.7 V)低于设定电压(〜1.7 V),在真空环境下性能降低。我们提出了一种Si-DBs渗滤模型来解释上述特征。提出和讨论了支持我们模型的实验证据。

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