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The role of titanium in electromigrated tunnel junctions

机译:钛在电迁移隧道结中的作用

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A standard route for fabrication of nanoscopic tunnel junctions is via electromigration of lithographically prepared gold nanowires. In the lithography process, a thin adhesion layer, typically titanium, is used to promote the adhesion of the gold nanowires to the substrate. Here, we demonstrate that such an adhesion layer plays a vital role in the electrical transport behavior of electromigrated tunnel junctions. We show that junctions fabricated from gold deposited on top of a titanium adhesion layer are electrically stable at ambient conditions, in contrast to gold junctions without a titanium adhesion layer. We furthermore find that electromigrated junctions fabricated from pure titanium are electrically exceptionally stable. Based on our transport data, we provide evidence that the barrier in gold-on-titanium tunnel devices is formed by the native oxide of titanium.
机译:制备纳米隧道结的标准途径是通过光刻制备的金纳米线的电迁移。在光刻工艺中,通常使用钛的薄粘附层用于促进金纳米线与基底的粘附。在这里,我们证明了这种粘附层在电迁移隧道结的电传输行为中起着至关重要的作用。我们表明,与没有钛粘附层的金结相反,由沉积在钛粘附层顶部的金制成的结在环境条件下是电稳定的。我们还发现,由纯钛制成的电迁移结在电学上非常稳定。根据我们的运输数据,我们提供证据表明钛金隧道设备中的阻挡层是由钛的天然氧化物形成的。

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