首页> 外文期刊>Applied Physics Letters >Degradation of low frequency noise in SiGe- and SiGeC-surface channel p-type metal-oxide-semiconductor field effect transistor due to consuming the Si cap
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Degradation of low frequency noise in SiGe- and SiGeC-surface channel p-type metal-oxide-semiconductor field effect transistor due to consuming the Si cap

机译:由于消耗了硅电容,导致SiGe和SiGeC表面沟道p型金属氧化物半导体场效应晶体管中低频噪声的降低

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This letter reports on the noise degradation mechanism in SiGe- and SiGeC-surface channel p-type metal-oxide-semiconductor field-effect transistors (pMOSFETs). Compared to their Si reference, the surface SiGe pMOSFETs show only slightly lower or even comparable noise (at low gate bias), while the SiGeC devices exhibit higher noise amplitude for the full bias range, unlike previously reported buried SiGe pMOSFETs with significantly improved noise over their Si control. The degradation can be attributed to Si-cap consumption and thus the cancellation of buried channel operation. [C] incorporation further degrades noise characteristics due to inferior quality of epilayer and higher interface trap density.
机译:这封信报道了SiGe和SiGeC表面沟道p型金属氧化物半导体场效应晶体管(pMOSFET)的噪声衰减机理。与Si参考相比,表面SiGe pMOSFET的噪声仅略低甚至可比(在低栅极偏置下),而SiGeC器件在整个偏置范围内均表现出更高的噪声幅度,这与之前报道的埋入式SiGe pMOSFET相比,其噪声得到了显着改善。他们的Si控制。退化可归因于硅电容的消耗,因此可消除埋入式沟道操作。 [C]的掺入由于外延层的劣质和较高的界面陷阱密度而进一步降低了噪声特性。

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