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Mechanical behavior of ultralow-dielectric-constant mesoporous amorphous silica

机译:超低介电常数介孔无定形二氧化硅的力学行为

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Using molecular-dynamics simulations, we examine the mechanical behavior of mesoporous amorphous silicas that are considered as ultralow-dielectric-constant materials in microelectronics. We study structures with a regular array of spherical pores and densities between 88% and 72% of the amorphous silica normal density. We find that the Young modulus depends on density according to a sublinear power-law scaling relationship and decreases with decreasing mesopore size. Upon uniaxial compression, an elastic instability is triggered in structures with less-than-critical density or mesopore size.
机译:使用分子动力学模拟,我们研究了中孔无定形二氧化硅的机械性能,该二氧化硅在微电子学中被视为超低介电常数材料。我们研究了规则排列的球形孔结构,其密度介于无定形二氧化硅正常密度的88%至72%之间。我们发现,杨氏模量取决于亚线性幂律比例关系的密度,并且随着中孔尺寸的减小而减小。在单轴压缩时,密度小于临界密度或中孔尺寸的结构会触发弹性不稳定性。

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