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Hole mobility modulation of solution-processed nickel oxide thin-film transistor based on high-k dielectric

机译:基于高k电介质的固溶氧化镍薄膜晶体管的空穴迁移率调制

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摘要

Solution-processed p-type oxide semiconductors have recently attracted increasing interests for the applications in low-cost optoelectronic devices and low-power consumption complementary metal-oxide-semiconductor circuits. In this work, p-type nickel oxide (NiO_x) thin films were prepared using low-temperature solution process and integrated as the channel layer in thin-film transistors (TFTs). The electrical properties of NiO_x TFTs, together with the characteristics of NiO_x thin films, were systematically investigated as a function of annealing temperature. By introducing aqueous high-k aluminum oxide (Al_2O_3) gate dielectric, the electrical performance of NiO_x TFT was improved significantly compared with those based on SiO_2 dielectric. Particularly, the hole mobility was found to be 60 times enhancement, quantitatively from 0.07 to 4.4 cm~2/V s, which is mainly beneficial from the high areal capacitance of the Al_2O_3 dielectric and high-quality NiO_x/Al_2O_3 interface. This simple solution-based method for producing p-type oxide TFTs is promising for next-generation oxide-based electronic applications.
机译:溶液处理的p型氧化物半导体最近在低成本光电器件和低功耗互补金属氧化物半导体电路中的应用吸引了越来越多的兴趣。在这项工作中,使用低温溶液工艺制备了p型氧化镍(NiO_x)薄膜,并将其集成为薄膜晶体管(TFT)中的沟道层。系统地研究了NiO_x TFTs的电性能以及NiO_x薄膜的特性与退火温度的关系。通过引入水性高k氧化铝(Al_2O_3)栅极电介质,与基于SiO_2电介质的电介质相比,NiO_x TFT的电性能得到了显着改善。特别地,发现空穴迁移率提高了60倍,定量地从0.07提高到4.4cm 2 / V s,这主要得益于Al_2O_3电介质的高面积电容和高质量的NiO_x / Al_2O_3界面。这种用于生产p型氧化物TFT的简单的基于溶液的方法对于下一代基于氧化物的电子应用是有希望的。

著录项

  • 来源
    《Applied Physics Letters》 |2016年第23期|233506.1-233506.5|共5页
  • 作者单位

    College of Physics, Qingdao University, Qingdao 266071, China,College of Electronics and Information Engineering, Qingdao University, Qingdao 266071, China,Lab of New Fiber Materials and Modern Textile, Growing Base for State Key Laboratory, Qingdao University, Qingdao 266071, China;

    College of Physics, Qingdao University, Qingdao 266071, China,College of Electronics and Information Engineering, Qingdao University, Qingdao 266071, China,Lab of New Fiber Materials and Modern Textile, Growing Base for State Key Laboratory, Qingdao University, Qingdao 266071, China;

    College of Physics, Qingdao University, Qingdao 266071, China,College of Electronics and Information Engineering, Qingdao University, Qingdao 266071, China,Lab of New Fiber Materials and Modern Textile, Growing Base for State Key Laboratory, Qingdao University, Qingdao 266071, China;

    Electronic Ceramics Center, DongEui University, Busan 614-714, South Korea;

    Department of Materials SciencelCENIMAT-I3N, Faculty of Sciences and Technology, New University of Lisbon and CEMOP-UNINOVA, Campus de Caparica, 2829-516 Caparica, Portugal;

    Department of Materials SciencelCENIMAT-I3N, Faculty of Sciences and Technology, New University of Lisbon and CEMOP-UNINOVA, Campus de Caparica, 2829-516 Caparica, Portugal;

    College of Physics, Qingdao University, Qingdao 266071, China,College of Electronics and Information Engineering, Qingdao University, Qingdao 266071, China,Lab of New Fiber Materials and Modern Textile, Growing Base for State Key Laboratory, Qingdao University, Qingdao 266071, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-18 03:14:39

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