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The fabrication and characterization of flexible single-crystalline silicon and germanium p-intrinsic-n photodetectors on plastic substrates

机译:塑料基板上的柔性单晶硅和锗p-本征-n光电探测器的制造与表征

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摘要

The flexible photodetector is the essential device for many of the optoelectronic applications and its performance can be influenced by a number of factors, including semiconductor materials, illumination conditions, device structures, etc. Therefore, in order to better design and use the flexible photodetectors, it is necessary to understand how these factors affect their performance. In this study, we fabricated flexible lateral p-intrinsic-n photodetectors formed with single-crystalline silicon and germanium nanomembranes on polyethylene terephthalate substrates. The performance of the flexible photodetectors with various dimensions is presented under different illumination conditions. The influences of different semiconductor materials, illumination conditions (wavelength and power of the incident light), and dimensions of the intrinsic region (length and width) on the photocurrent and efficiency are investigated, and the underlying mechanisms are studied based on experimental, simulation, and theoretical analysis. The results provide guidelines for the design and fabrication of flexible single-crystalline semiconductor photodetectors on the plastic substrates.
机译:柔性光电探测器是许多光电应用中必不可少的设备,其性能会受到许多因素的影响,包括半导体材料,照明条件,器件结构等。因此,为了更好地设计和使用柔性光电探测器,有必要了解这些因素如何影响其性能。在这项研究中,我们在聚对苯二甲酸乙二醇酯基板上制造了由单晶硅和锗纳米膜形成的柔性横向p-本征-n光电探测器。各种尺寸的柔性光电探测器的性能均在不同的照明条件下呈现。研究了不同半导体材料,照明条件(入射光的波长和功率)以及本征区域的尺寸(长度和宽度)对光电流和效率的影响,并基于实验,模拟,和理论分析。结果为在塑料基板上设计和制造柔性单晶半导体光电探测器提供了指导。

著录项

  • 来源
    《Applied Physics Letters》 |2017年第25期|160-164|共5页
  • 作者单位

    School of Microelectronics, Tianjin University, Tianjin 300072, People's Republic of China,Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, People's Republic of China;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    School of Microelectronics, Tianjin University, Tianjin 300072, People's Republic of China;

    School of Microelectronics, Tianjin University, Tianjin 300072, People's Republic of China,Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    253104.1-253104.5;

    机译:253104.1-253104.5;
  • 入库时间 2022-08-18 03:14:09

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