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High mobility ultra-thin crystalline indium oxide thin film transistor using atomic layer deposition

机译:利用原子层沉积的高迁移率超薄晶体氧化铟薄膜晶体管

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摘要

Stoichiometric crystalline binary metal oxide thin films can be used as channel materials for transparent thin film transistors. However, the nature of the process used to fabricate these films causes most binary metal oxide thin films to be highly conductive, making them unsuitable for channel materials. We overcame this hurdle by forming stoichiometric ultra-thin (5 nm) crystalline In2O3 films by using a thermal atomic layer deposition method. Specifically, (3-(dimethylamino) propyl)dimethylindium was used as a liquid precursor and ozone as an oxygen source to grow In2O3 thin films at a high growth rate of 0.06 nm/cycle. Adjustment of the deposition processing temperature followed by annealing in an oxygen atmosphere enabled us to fully crystallize the film into a cubic bixbyite structure with the retained stoichiometry. The transparent crystalline ultra-thin In2O3-based bottom-gate thin film transistors showed excellent and statistically uniform switching characteristics such as a high I-on/I-off ratio exceeding 10(7), a high linear mobility of 41.8 cm(2)/V s, a small subthreshold swing of 100 mV/dec, and a low hysteresis of 0.05 V. Our approach offers a straightforward scheme, which is compatible with oxide electronics, for fabricating a transparent metal oxide device without resorting to complicated oxide compositional strategies. Published by AIP Publishing.
机译:化学计量的晶体二元金属氧化物薄膜可以用作透明薄膜晶体管的沟道材料。然而,用于制造这些膜的过程的性质导致大多数二元金属氧化物薄膜具有高导电性,从而使其不适用于沟道材料。我们通过使用热原子层沉积方法形成化学计量的超薄(5 nm)晶体In2O3薄膜克服了这一障碍。具体地,将(3-(二甲基氨基)丙基)二甲基铟用作液体前体,将臭氧用作氧源,以0.06nm /周期的高生长速率生长In 2 O 3薄膜。调节沉积工艺温度,然后在氧气气氛中进行退火,使我们能够将膜完全结晶成具有化学计量比的立方方铁矿结构。基于In2O3的透明晶体超薄底栅薄膜晶体管显示出出色且统计上均匀的开关特性,例如高I-I / I-off比超过10(7),41.8 cm(2)的高线性迁移率/ V s,100 mV / dec的小亚阈值摆幅和0.05 V的低磁滞。我们的方法提供了一种简单的方案,该方案与氧化物电子产品兼容,可用于制造透明金属氧化物器件,而无需借助复杂的氧化物组成策略。由AIP Publishing发布。

著录项

  • 来源
    《Applied Physics Letters》 |2018年第11期|112102.1-112102.5|共5页
  • 作者单位

    Korea Univ, Dept Electromech Syst Engn, Sejong 339700, South Korea;

    ETRI, Real Device Res Div, Daejeon 34129, South Korea;

    ETRI, Real Device Res Div, Daejeon 34129, South Korea;

    ETRI, Real Device Res Div, Daejeon 34129, South Korea;

    ETRI, Real Device Res Div, Daejeon 34129, South Korea;

    ETRI, Real Device Res Div, Daejeon 34129, South Korea;

    Korea Univ, Dept Electromech Syst Engn, Sejong 339700, South Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-18 03:13:56

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