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N-polar GaN/AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistor formed on sapphire substrate with minimal step bunching

机译:在蓝宝石衬底上形成的N极GaN / AlGaN / GaN金属绝缘体半导体高电子迁移率晶体管具有最小的台阶束

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摘要

The metal-insulator-semiconductor (MIS) gate N-polar GaN/AlGaN/GaN high-electron-mobility transistor (HEMT) on a (0001) sapphire substrate, which can be expected to operate with lower on-resistance and more easily work on the pinch-off operation than an N-polar AlGaN/GaN HEMT, was fabricated. For suppressing the step bunching and hillocks peculiar in the N-polar growth, a sapphire substrate with an off-cut angle as small as 0.8 degrees was introduced and an N-polar GaN/AlGaN/GaN HEMT without the step bunching was firstly obtained by optimizing the growth conditions. The previously reported anisotropy of transconductance related to the step was eliminated. The pinch-off operation was also realized. These results indicate that this device is promising. (C) 2018 The Japan Society of Applied Physics
机译:(0001)蓝宝石衬底上的金属绝缘体(MIS)栅极N极GaN / AlGaN / GaN高电子迁移率晶体管(HEMT),可以预期以较低的导通电阻工作并且更容易工作在夹断操作上,制造了N极AlGaN / GaN HEMT。为了抑制N极生长所特有的阶梯聚束和小丘,引入了切割角小至0.8度的蓝宝石衬底,并且首先通过以下步骤获得了没有阶梯聚束的N极性GaN / AlGaN / GaN HEMT:优化生长条件。消除了先前报告的与该步骤有关的跨导各向异性。夹断操作也得以实现。这些结果表明该设备是有前途的。 (C)2018日本应用物理学会

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  • 来源
    《Applied physics express》 |2018年第1期|015503.1-015503.4|共4页
  • 作者单位

    Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan;

    Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan;

    Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan;

    Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan;

    Tohoku Univ, Ctr Innovat Integrated Elect Syst, Sendai, Miyagi 9800845, Japan;

    Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan;

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