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Approximate analytical model for solidification in a finite PCM storage with internal fins

机译:带有内部散热片的有限PCM存储器中凝固的近似分析模型

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In latent heat storage internal heat transfer enhancement techniques such as fins have to be used because of the low heat conductivity of the phase change material. Internal heat transfer enhancement is essential, especially in a solidification process where the main heat transfer mode is conduction. The aim of this paper is to present a simplified analytical model which predicts the solid-liquid interface location and temperature distribution of the fin in the solidification process with a constant end-wall temperature in the finned two-dimensional PCM storage. The analytical results are compared to numerical results and they show that the analytical model is more suited to the prediction of the solid-liquid interface location than the temperature distribution of the fin in the PCM storage. A new factor called the fraction of solidified PCM is also introduced. The fraction of solidified PCM easily gives a good picture of how much of the storage is solidified after a given time.
机译:在潜热存储中,由于相变材料的低导热率,必须使用内部传热增强技术,例如散热片。内部传热的增强是必不可少的,尤其是在主要传热模式为传导的固化过程中。本文的目的是提供一个简化的分析模型,该模型可预测翅片二维PCM存储器中端壁温度恒定的凝固过程中翅片的固液界面位置和温度分布。将分析结果与数值结果进行比较,结果表明,与PCM存储器中翅片的温度分布相比,该分析模型更适合于固液界面位置的预测。还介绍了一个新的因子,称为固化PCM的分数。固化的PCM分数很容易给出给定时间后固化多少存储量的良好信息。

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