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机译:考虑导电粒子随机排列的导电胶中导电渗透的Ising模型
Department of Physics, Bandung Institute of Technology, Jalan Ganeca 10 Bandung 40132, Indonesia;
Department of Physics, Bandung Institute of Technology, Jalan Ganeca 10 Bandung 40132, Indonesia;
Department of Physics, Bandung Institute of Technology, Jalan Ganeca 10 Bandung 40132, Indonesia;
Department of Physics, Bandung Institute of Technology, Jalan Ganeca 10 Bandung 40132, Indonesia;
electrically conductive adhesives; percolation; ising model; average coordination number; thermody namically; structures having; simulation development;
机译:考虑导电粒子的随机排列的导电胶中导电渗流的伊辛模型科学出版物
机译:预测导电胶应用中银/环氧复合材料渗透阈值的粒子排列设计
机译:各向异性导电胶的导电:导电填料颗粒尺寸分布的影响
机译:是否可以用纳米颗粒进行导电粘合剂,常用的导电粘合剂没有纳米颗粒?
机译:使用复杂尺寸填料的导电粘合剂中的低渗透阈值
机译:银纳米线-银纳米粒子-石墨烯纳米片复合材料的水热法制备可提高导电胶的导电性能
机译:考虑导电粒子随机排列的导电胶粘剂导电渗流模型