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The electrical analog for determining temperature distribution in electrical components

机译:用于确定电气组件中温度分布的电气模拟

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摘要

SPACE and weight limitations in present-day aircraft necessitate miniaturization of air-borne electric equipment. Such miniaturization generally results in high heat dissipation per unit volume which may lead to local temperatures which exceed the material limitations, causing failure of the component. To avoid such failure, electrical engineers must examine the heat-transfer problem when designing compact electric apparatus. It is the purpose of this paper to present a method of heat-transfer analysis which is relatively simple and straightforward and which utilizes concepts and equipment familiar to electrical engineers. The proposed method is based on the fact that the differential equations describing the flow of heat are identical to those for the flow of electric current; consequently, an electrical analog of the heat-flow problem can be readily constructed and the electrical measurements of current and voltage can be directly translated to the equivalent thermal quantities, heat flow and temperature.
机译:当今飞机的空间和重量限制要求使机载电气设备小型化。这种小型化通常导致每单位体积的高散热,这可能导致局部温度超过材料极限,从而导致部件失效。为避免此类故障,电气工程师在设计紧凑型电气设备时必须检查传热问题。本文的目的是提出一种传热分析的方法,该方法相对简单直接,并且利用了电气工程师熟悉的概念和设备。所提出的方法基于以下事实:描述热流的微分方程与用于电流的微分方程是相同的。因此,可以容易地构造热流问题的电模拟,并且可以将电流和电压的电测量结果直接转换为等效的热量,热流和温度。

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