Thermomechanical Behavior of BME Capacitors During Binder Burnout

摘要

The deformation behavior of base-metal electrode-multilayer ceramic capacitors during binder burnout has been characterized using thermomechanical analysis, and the results have been compared to thermogravimetric analysis data. Multilayer ceramic capacitor (MLCC) manufacturers recently have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamina-tion and deleterious electrode oxidation. The deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout has been characterized using thermomechanical analysis (TMA), and the results have been compared to thermogravimetric analysis (TGA) data.