Mixed Assembly on PCB using a Novel Flip-Chip Technology

摘要

The article describes the fabrication and performance of a mixed assembly demonstrator, where the intro-duced flip-chip-on-board (FCOB) technology is proven to be compatible with the reflow and wave solder assembly. The novel FCOB process uses both isotropic conductive adhesives (ICA) and non-conductive adhe-sives (NCA). On a small set of test samples, contact resistances lower than 25mΩ were measured consistently on 7x7mm~2 chips. No defects were observed on the flip-chip interconnections after submission of these assemblies to standard solder reflow or wave solder processes.