IMAPS Joins Forces with CMP Media to Launch Denver-Based HD International

摘要

One of IMAPS' main objectives is to deliver critical educational opportunities on technologies and techniques that enable the advancement of microelectronics. IMAPS recently joined forces with CMP Media to continue this tradition with the launch of the International Conference and Exhibition on High Density Interconnect and Systems Packaging (HD International) April 25-28, 2000, in Denver, Colorado. HD International will bring together packaging, research and manufacturing engineers, and their managers to learn how new and emerging technologies will help solve present and future packaging challenges.