Characterization of Die Stress in Flip Chip on Laminate Assemblies

摘要

A powerful method for experimental evaluation of silicon die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, an overview of recent measurements made in flip chip on laminate assemblies with (111) silicon test chips is presented. Stress variations are presented during underfill cure and as a function of thermal cycling, and interesting observations are noted and discussed.