Metal Printing of Copper Interconnects down to 500nm using ECPR - Electrochemical Pattern Replication

摘要

Replisaurus Technologies has demonstrated printing of copper patterns with dimensions from 100μm down to 500nm lines and 280nm space using its patented ECPR method. With ECPR the traditional eight step metallization scheme based on lithography and plating (Fig. 1a) can be replaced by a three step direct metal printing scheme (Fig. 1b). By eliminating all steps of polymer processing, the ECPR technology offers improved process control and significant cost and cycle time savings.