Embedding a Thin Polymer Voltage ESD Suppressing Core in a Chip Package Offers and Alternative to on Chip ESD Protection of Sensitive High Performance ICs Used in Today's Cell Phones and Computers

摘要

Each year billions of dollars worth of electronics is damaged or made inoperable due to the effects of Electro-Static-Discharge (ESD). As gate geometries of devices shrink, making them more susceptible to being damaged by even lower voltages, it is vital that a high speed low capacitance means of protection be developed and implemented. Typically, designers have utilized diodes, transsorbs, or surge protection devices to protect the electronics. These devices are expensive, take up valuable real estate in the electronic assembly, and only provide a modicum of protection. This paper presents a new, disruptive technology that offers the low capacitance levels needed for today's high speed applications, a reduced footprint to facilitate the smaller product designs, and a faster switching speed that offers better ESD protection.