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Comparison of LTCC Material Systems through Dielectric and Transmission Characterization for Microwave/Millimeter Wave Applications

机译:通过介电和透射特性比较LTCC材料系统在微波/毫米波应用中的比较

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There has been considerable research effort to develop W band millimeter wave automotive-based radar systems. Research has been concentrated around the development of active components and subsystems to meet performance requirements. Sub-system and component level packaging of millimeter wave systems remains the major cost driver. Low temperature co-fired ceramic (LTCC) technology offers very specific advantages both in terms of performance and cost. This is due to advances in ceramic processing, material systems and the availability of the vertical dimension due to its multi-layer structure. This paper presents the evaluation of five LTCC material systems. The focus of this work is to achieve dielectric characterization in the frequency range 10 to 110 GHz, to a level of accuracy acceptable for packaging system design as well as to investigate transmission characteristics of traditional transmission lines fabricated on these substrates. Transmission line resonators are used to do the characterization. Resonators are designed through rigorous, iterative full electromagnetic simulations. A set of microstrip and CPW transmission lines, with varying lengths and launch sections are also designed and fabricated to evaluate the feasibility of low-loss transmission lines on LTCC in millimeter wave frequency ranges. Different types of microstrip to CPW transitions are also designed, fabricated and characterized since transitions are a fundamental building block in package design. All measurements are performed in the 10 to 110 GHz range. The paper reports details of design, simulation and characterization of the above-mentioned test structures as well as dielectric and transmission data.
机译:为了开发基于W波段毫米波汽车的雷达系统,已经进行了大量的研究工作。为了满足性能要求,研究集中在有源组件和子系统的开发上。毫米波系统的子系统和组件级封装仍然是主要的成本驱动因素。低温共烧陶瓷(LTCC)技术在性能和成本方面均具有非常特殊的优势。这是由于陶瓷加工,材料系统的进步以及由于其多层结构而可获得的垂直尺寸。本文介绍了五个LTCC材料系统的评估。这项工作的重点是在10至110 GHz的频率范围内实现介电特性鉴定,达到封装系统设计可接受的精度水平,并研究在这些基板上制造的传统传输线的传输特性。传输线谐振器用于进行表征。谐振器是通过严格的迭代全电磁仿真设计的。还设计和制造了一组具有不同长度和发射截面的微带和CPW传输线,以评估LTCC在毫米波频率范围内低损耗传输线的可行性。由于过渡是封装设计的基本组成部分,因此还设计,制造和表征了不同类型的微带到CPW过渡。所有测量均在10至110 GHz范围内进行。该论文报告了上述测试结构的设计,仿真和表征以及介电和传输数据的详细信息。

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