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首页> 外文期刊>Advancing Microelectronics >Self-Assembled Monolayer Coating for Non-stick Encapsulation Mold
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Self-Assembled Monolayer Coating for Non-stick Encapsulation Mold

机译:不粘封装模具的自组装单层涂层

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摘要

A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an alternative of the environmentally -unfriendly electroplated hard-Cr coating but its cost is high. In this paper, we report a self-assembled monolayer (SAM) technique that uses methacryloxypropyl trimethoxysilane (MPTMS) as the coupling agent for photo crosslinking to form a dense and durable anti-stick film on the encapsulation mold surface. The presence of the coated MPTMS thin film was identified by the X-ray photoelectron spectroscopy (XPS). Hydrophobicity and roughness of the film were analyzed through contact angle measurement and 3D optical imaging profiler, respectively. Mold releasing tests show that the MPTMS coating has a better mold releasing capability than electroplating hard-Cr and PVD CrN coatings.
机译:影响生坯包装的可靠性和成品率的主要因素是生坯模塑料和封装模具之间的粘合性。通过物理气相沉积(PVD)在模具上形成的不粘涂层被认为是对环境不友好的电镀硬铬涂层的替代方法,但是其成本很高。在本文中,我们报告了一种自组装单层(SAM)技术,该技术使用甲基丙烯酰氧基丙基三甲氧基硅烷(MPTMS)作为偶联剂进行光致交联,从而在封装模具表面形成致密且耐用的防粘膜。通过X射线光电子能谱法(XPS)鉴定出涂覆的MPTMS薄膜的存在。分别通过接触角测量和3D光学成像轮廓仪分析了薄膜的疏水性和粗糙度。脱模测试表明,MPTMS涂层具有比电镀硬铬和PVD CrN涂层更好的脱模能力。

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