Nordson Corporation and The Microelectronics Foundation Present a Student Award for Best Student Paper at the Device Packaging Conference

摘要

Mr. Yang Lin of the University of Arkansas was presented $1,000 from the Nordson Corporation in conjunction with The Microelectronics Foundation on March 18, 2008, at the Device Packaging Conference in Scottsdale, AZ. The paper "Integrated System Development for 3-D VLSI" describes the University of Arkansas' development of a novel 3-D packaging technology by die stacking. TSVs are etched and filled with copper to provide electrical connections from the active face to the back side of wafers.