Global Business Council Addresses Cost and Performance-Driven Semiconductor Packaging Challenges through the Supply Chain

摘要

On March 16 & 17, the Global Business Council held its annual spring conference in Scottsdale in conjunction with the Device Packaging Conference. Industry experts addressed issues of concern to our corporate members and answered these questions: What are the specific areas where assembly and packaging costs need to be addressed to enable the growth of the industry? Where are the applications where performance rather than cost is the absolute driver? What and where are the opportunities within the supply chain to meet these challenges and how many companies benefit from providing solutions?