Greetings IMAPS members and other interested parties from the technical community!

摘要

I hope you can come and participate at the 43rd Annual International Symposium on Microelectronics, Oct 31-Nov 4, 2010. We have a strong technical program in addition to the vendor exhibition hall. We've enhanced the program with some exciting new additions including a conference-long technical track on 3D packaging, one of the fastest growing areas in microelectronics today. Note too that this year's program is in a new venue - the Research Triangle Park (RTP) area in NC featuring Raleigh's brand new convention center. RTP offers an abundance of high technology companies, renowned research institutes, consortia and universities that have been famous for the development of the area. One might ask why we would move to a new venue since established venues have infrastructure and history on their side.