Quilt Packaging:A Revolutionary and Flexible Approach to High-Performance System in Package

摘要

Introduction As processing nodes continue to decrease, and lighter integration is desired, packaging has become a prominent factor in electronic systems performance. To maintain the pace of innovation in microelectronics systems set by Moore's Law, industry has been focused on modify-ing or extending current technologies and implementing so-called 3D packaging (through-silicon-via (TSV), wafer level packaging, die stacking). Many applications exist where current 3D approaches are sufficient, but significant obstacles to wide-spread adoption remain. In many cases, current approaches simply will not work due to thermal issues, coefficient of thermal expansion (CTE) mismatch-es, and other difficulties. Indiana Integrated Circuits, LLC (IIC) (www.indianaic.com) offers an alternative solution, particularly for RF/microwave systems composed of dis-parate materials.