A Design Tool Fully Adapted to Develop a Thin Film Packaging Process Used for MEMS Devices

摘要

This paper deals with the development of thin film encapsulation for MEMS devices. A simulation-based methodology is reported to study the mechanical response of cap membrane. For the first time, both deflection and stiffness measurements are considered to build the finite element model that simulates a thin film packaging. The cap release operation is used as a study case to illustrate this methodology. Promising results are reported as numerical and experimental data remarkably fit, and residual stresses inside cap material can be accurately estimated. Then, design investigations are discussed and confirm the relevance of the finite element model.