3D IC Patent Landscape: Wide Expansion of Invention, but Tight Concentration of Control of Much of the Key IP for 2.5D/3D TSV Technology

摘要

The IC industry's push into 3D solutions for next generation chip integration has brought an explosion of research work recently, with roughly 1000 relevant patents now granted or pending to some 260 organizations, as of the end of 2012. But control of this intellectual property is quite concentrated at a few players. The top 10 assignees hold nearly half of those patents, and a handful of leading companies hold a large share of what look to be the most important intellectual property rights.