Keynotes

摘要

The semiconductor packaging roadmaps have been veering towards an inflexion point over the last few years. Competing and somewhat orthogonal demands of the mobile revolution, internet of things (loT) and the potential "slowdown" of Moore's law has been driving many new trends and innovations in packaging. The applications space, i.e., end use constraints require "out of box" thinking even in "classical packaging" such as wire bonding or large body LGA packages. I will discuss key trends based on business applications and summarize advantages and challenges with a "call to arms" for innovation.