Embedding Active and Passive Devices in Medical Electronics

摘要

We have presented and discussed the use of embedded die in flexible circuits for hearing aid applications. We have shown that significant size reduction is possible in combination with performance increase. In addition to what we have already discussed, these chip-in-flex modules also passed necessary reliability tests, packaging and labeling criteria, visual inspection, dimensional analysis, and construction analysis. We expect that this technology will be part of mainstream hearing aid production for years to come. Recent announcements have shown this technology is only in its beginning stages and many improvements are likely to come over the next few years.