Stud Bump Bonding: Flip Chip Enabling Technology

摘要

Stud bump bonding is a modified wire bonding process. Like wire bonding, there is bonding of the ball to the die pad. Unlike wire bonding, there is no second wire bond to a lead. The wire is terminated after the first bond, so there is only a bump on the die pad. To complete the interconnect, the die is flip-chipped onto a substrate using a ther-mosonic or thermocompression process. The stud bump process is mainly performed at the wafer level for volume production applications. This process can be used for singulated die, but is less attractive for volume production because of the additional handling time and the risk of damaging bare die.