Embedded Rf Component And Devices In 3d Lcp Package

摘要

In the world of electronic device manufacturing, thin has become a buzz word - encompassing die, dielectric, passives, and ultimately resulting in thin packages. This series of articles by Swapan K. Bhattacharya, John Papapolymerou, et al. of Georgia Tech's PRC overviews trends from thick to thin packages with embedded RF passive and active components within a flexible microwave organic substrate that can perform at frequencies in the range 2-110 GHz.