Transfer-Printing of As-Fabricated Carbon Nanotube Devices onto Various Substrates

摘要

Most nanoelectronic devices are fabricated on rigid, flat, and smooth substrates such as Si/SiO_2, since well-established semiconducting fabrication processes are typically utilized for such devices. However, there has been growing interest in non-conventional substrates such as soft plastic or nonplanar ones for possible applications in flexible, foldable, or implant-able electronics. For these future applications, it is essential to establish fabrication processes for devices on diverse substrates.