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Enhanced Thermoelectric Properties of Cu2SnSe3 by (Ag,In)-Co-Doping

机译:(Ag,In)-Co掺杂增强Cu2SnSe3的热电性能

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摘要

Dense bulk samples of (Ag,In)-co-doped Cu2SnSe3 have been prepared by a fast and one-step method of combustion synthesis, and their thermoelectric properties have been investigated from 323 to 823 K. The experimental results show that Ag-doping at Cu site remarkably enhances the Seebeck coeffi cient, reduces both electrical and thermal conductivities, and finally increases the figure of merit (ZT) value. The ZT of the Cu1.85Ag0.15SnSe3 sample reaches 0.80 at 773 K, which is improved by about 70% compared with the unadulterated sample (ZT = 0.46 at 773 K). First principle calculation indicates that Ag-doping changes the electronic structure of Cu2SnSe3 and results in larger effective mass of carriers, thus enhancing the Seebeck coeffi cient and reducing the electrical conductivity. The low electrical conductivity caused by Ag-doping can be repaired by accompanying In-doping at Sn site, and by (Ag, In)-co-doping the thermoelectric properties are further promoted. The (Ag, In)-co-doped sample of Cu1.85Ag0.15Sn0.9In0.1Se3 shows the maximum ZT of 1.42 at 823 K, which is likely the best result for Cu2SnSe3 -based materials up to now. This work indicates that co-doping may provide an effective solution to optimize the conflicting material properties for increasing ZT.
机译:通过快速一步燃烧合成方法制备了(Ag,In)共掺杂的Cu2SnSe3的致密块状样品,并在323 K至823 K之间研究了它们的热电性能。实验结果表明,Ag掺杂在Cu处显着提高塞贝克系数,降低电导率和热导率,并最终提高品质因数(ZT)值。 Cu1.85Ag0.15SnSe3样品的ZT在773 K时达到0.80,与纯净样品相比(在773 K时ZT = 0.46)提高了约70%。第一性原理计算表明,Ag掺杂改变了Cu2SnSe3的电子结构,并导致更大的有效载流子质量,从而提高了塞贝克系数并降低了电导率。 Ag掺杂引起的低电导率可以通过在Sn部位伴随In-掺杂来修复,并且通过(Ag,In)-共掺杂可以进一步提高热电性能。 Cu1.85Ag0.15Sn0.9In0.1Se3的(Ag,In)共掺杂样品在823 K处显示最大ZT为1.42,这可能是迄今为止基于Cu2SnSe3的材料的最佳结果。这项工作表明,共掺杂可以提供一种有效的解决方案,以优化冲突的材料特性以增加ZT。

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  • 来源
    《Advanced Functional Materials》 |2016年第33期|6025-6032|共8页
  • 作者单位

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China|Univ Chinese Acad Sci, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China;

    Beijing Computat Sci Res Ctr, Beijing 100193, Peoples R China;

    Beijing Computat Sci Res Ctr, Beijing 100193, Peoples R China;

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China;

    Tsinghua Univ, Sch Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China;

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China;

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China;

    Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China;

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